Heat sink compound, commonly known as thermal paste, is electrically non-conductive. Its primary purpose is to enhance thermal conductivity between a heat-generating component, like a CPU or GPU, and a heat sink or cooling solution. By filling in microscopic imperfections and air gaps between the two surfaces, it improves the transfer of heat, helping to keep the component cool.
We design thermal pastes with materials that have low electrical conductivity to prevent any possibility of short circuits or electrical interference when applied between electronic components. This is essential because these compounds are often used in areas where electronic components are densely packed together.