Heat Sink Compound

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Heat sink compound, which is also called thermal grease, thermal paste thermal compound, CPU grease, heat paste, heat sink paste, and thermal interface material, is designed to efficiently transfer heat away from a heat generating component. For electrical applications, heat sink compound is used to thermally bond a component with a mechanical heat sink. The compound fills the gap between the CPU (central processing unit) or other heat generating components.

In addition, heatsink paste is used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required. Although heatsink paste does not have the thermal conductivity of metals like copper and silver, the improvement over the air will increase thermal responsiveness

 

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Transistor Silicone Heat Sink Grease	Heat Sink Compound - Silicone
Heat Sink Compound for electrical applications- This transistor silicone heat sink grease is ideal for electrical applications. Used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required.
Silicone-Free Heat Sink Silicone-Free Heat Sink Compound
Heat sink compound for electronics, avoid silicone contamination- Ideal for electronic applications where silicone contamination hurts solderability and increases solder defects

Articles

How Heat Sink Compound Keeps Electronics Cool
What is heat sink compound? Heat sink compound (also called thermal grease, thermal compound, CPU grease, heat paste, heat sink paste, and thermal interface material) is a sticky paste that's used as an interface between CPU heat sinks and heat sources. What is the purpose of heat sink compound? Heat sink compound is used to fill the ga...
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