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Technical Data Sheet



Silicone-Free Heat Sink Compound


Silicone-Free Heat Sink Compound draws heat away when applied to a component.
Also known as thermal grease, thermal paste thermal compound, CPU grease, heat paste, heat sink paste, and thermal interface material.

In electronics, heat sink compound is generally used to thermally bond a component with a mechanical heat sink. For electrical applications, it is used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required.
Ideal for electronic applications where silicone contamination hurts solderability and increase solder defects.

Features & Benefits

  • Thermal conductivity - 0.92 W/m-K
  • Functional temperature range -40°F to 392°F (-40°C to 200°C)
  • Non-ozone depleting
  • Avoid solder defects due to silicon contamination
  • Easy application
  • Will not separate
  • Will not harden and crack
Packaging Order minimum case quantity only. Extra shipping fees may apply.
Name Size Units Per Case
1978-DP Silicone-Free Heat Sink Comp - 4oz 4 oz 24
1978-1 Silicone-Free Heat Sink Comp - 1 lb 1 lb 12