Silicone-Free Heat Sink Compound

Thermal paste for electronics -- avoid silicone migration & contamination

Part # Name Size Units
Per Case
1978-DP Silicone-Free Heat Sink Comp - 4oz 4 oz 24
1978-1 Silicone-Free Heat Sink Comp - 1 lb 1 lb 12
Packaging Order minimum case quantity only. Extra shipping fees may apply.
Order from an authorized distributor
Silicone-Free Heat Sink Compound draws heat away when applied to a component.
Also known as thermal grease, thermal paste thermal compound, CPU grease, heat paste, heat sink paste, and thermal interface material.

In electronics, heat sink compound is generally used to thermally bond a component with a mechanical heat sink. For electrical applications, it is used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required.
Ideal for electronic applications where silicone contamination hurts solderability and increase solder defects.

Features & Benefits

  • Thermal conductivity - 0.92 W/m-K
  • Functional temperature range -40°F to 392°F (-40°C to 200°C)
  • Non-ozone depleting
  • Avoid solder defects due to silicon contamination
  • Easy application
  • Will not separate
  • Will not harden and crack



How do I figure out the shelf life of heat sink compound?
On the tubes, a little lot # is stamped into the seal on the end. For a jar it is printed on the label. That is the date of manufacture.

Instructions on insterpreting the lot #:
  • First 2 digits are the month (1=January - 12=December)
  • Third digit represents the year (1=2021, 2=2022, etc.)
The expiration date is 5 years after the DOM.
My thermal paste seems like it's getting dried out. Can I re-solvate it?

Try adding VMP naphtha (a common paint thinner) to the compound at approximately 1 part VMP to 100 parts compound. Mix thoroughly to get it back to the consistency required. This is mostly by “eyeball” so you may need a little less or a little more, depending on how dry the material is.

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