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WonderMASK W Washable Solder Mask
None of our masks contain silicone and they leave no residue behind.
Particulates + surfactants during rinse = foam. Check filtration system or drain & recharge the rinse water system as necessary. The particulates may come from various sources, but excess solder flux being rinsed off the boards is a prime culprit. Bacteria in the water can cause foaming. Have a water sample analyzed.
Solder mask is engineered to withstand molten solder temperature for the very brief time (about a second) it is exposed in a typical wave soldering process. Most commercially available masks should be able to withstand melting point temperatures of lead-based and lead-free solder, up to 650°F (343°C). As exposure time is lengthened, like in a reflow oven, there is more potential the mask will bubble, char, and become brittle. How long a mask can withstand extreme temperatures depends on the thickness of the bead, and the type of mask.
No, temporary solder mask will not leave behind ionic residue that can lead to dendritic grown and board failure.
Spot mask can be hand applied, dispensed with a pneumatic system, or stencil printed. To hand apply using a squeeze dispensing bottle:
The shelf life of a product can be found on either the technical data sheet (TDS), available on the product page, or by looking on the certificate on conformance (COC). The COC can be downloaded by going to https://www.techspray.com/coc. Once you have the shelf life, you will need to add it to the manufacture date for a use-by date. The manufacture date can be identified by the batch number. The batch code used on most of our products are manufacture dates in the Julian Date format. The format is YYDDD, where YY = year, DDD = day. For example, 19200 translates to the 200th day of 2019, or July 19, 2019. This webpage explains and provides charts to help interpret our batch numbers: https://www.techspray.com/batch-codes.
The follow are factor to consider when trying to avoid breakage: